Three-in-one universal type, supporting tray, braiding, piping, burning/testing of IC in three packaging modes, marking and packaging conversion functions.
External tape braiding system supports 8-32MM wide-band adjustable mode, and 0-32 position with mosaic programmer can optionally meet customer production needs.
Taping can be equipped with dotting system, marking function on the chip surface to facilitate production management.
High-definition up and down CCD, automatic alignment IC coordinates, automatic X, Y, theta parameter adjustment, automatic offset correction data
It can burn and test 1-32 chips at a time, and its output capacity can reach 1000+200 UPH in an hour.
Automatic alarm, abnormal condition or burning completion of the machine will automatically alarm reminder function. Special Receiving Zone for Bad Products
Imported parts are used to ensure the service life and working stability of the equipment.
It is suitable for the burning of many ICs and has a wide range of applications.
This product is mainly used for testing/packaging conversion/identification of IC (integrated circuit)
Testable items:
IC TYPE:MCU,FLASH,EMMC,NAND FLASH,EPROM,Wait...
IC ENCAPSULATION:SOP,SSOP,TSSOP,MSOP,QFP,QFN,BGA,TQFP,LQFP,Wait...
IC Packing:Tray、Tube、Tape
technical specifications
Product model | ZL808-H | Machine architecture | Longmen architecture |
Fastest speed | 1000±100UPH/PCS | ngAccuracy of fetching and placi repetition | +/-0.02mm |
Travel range | X600mmY400mmZ50mm | Machine size | 1400×800×1300mm |
weight | 130KG | Soket Fetch and release mode | Z axis Press |
Suction nozzle | Single suction nozzle rotatable | Control system | PLC |
Workstation | 0-32Workstation optional | Power/Gas Source | 220V,50Hz/0.5MPa |
Suitable for IC packaging | SOP/QFN/BGA/QFP,All encapsulated IC | Suitable for programming | AP8000、204、7500、6104、Wait |
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