Universal two-in-one, supporting braiding, piping two packaging IC burning/testing, marking and packaging conversion functions.
External braiding system supports 8-32MM wide-band adjustable, convenient and fast. Braided piping supports interchangeable packaging.
Taping can be equipped with dotting system, marking function on the chip surface to facilitate production management.
It can be equipped with high-definition up and down CCD, automatic alignment of IC coordinates, automatic adjustment of X, Y and theta parameters, automatic correction of offset data.
It can burn and test 1-32 chips at a time. One hour production capacity can reach 1300 + 200 UPH.
Automatic alarm, abnormal condition or burning completion of the machine will automatically alarm reminder function. Special Receiving Zone for Bad Products
Imported parts are used to ensure the service life and working stability of the equipment.
The Chinese-English menu is displayed on the touch screen with a friendly user interface.
It is suitable for the burning of many ICs and has a wide range of applications.
This product is mainly used for testing/packaging conversion/identification of IC (integrated circuit)
Testable items:
IC TYPE:MCU,FLASH,EMMC,NAND FLASH,EPROM,Wait...
IC ENCAPSULATION:SOP,SSOP,TSSOP,MSOP,QFP,QFN,BGA,TQFP,LQFP,Wait...
IC Packing:Tube、Tape
technical specifications
Product model | ZL808-C | Machine architecture | Longmen architecture |
Fastest speed | 1300±200UPH | Accuracy of fetching and placing repetition | +/-0.02mm |
Travel range | X630mmY400mmZ50mm | Machine size | 1400×800×1300mm |
weight | 130KG | Soket Fetch and release mode | Z axis Press/Cylinder press cap |
Suction nozzle | Single suction nozzle rotatable | Control system | PLC |
Workstation | 0-32Workstation optional | Power/Gas Source | 220V,50Hz/0.5MPa |
Suitable for IC packaging | SOP/QFN/BGA/QFP,All encapsulated IC | Suitable for programming | AP8000、7500、Max Wiz、SOFI、Wait |
c
o
n
s
u
l
t
Click
QQ:1074385598