Large capacity burning test robot is three-in-one, tray, tape, tube-mounted burning/testing/packaging/marking robot.
The tray automatic feeding system is adopted, and 20 trays are discharged and discharged at one time. There is no need to think that the intervention of automatic discharging after burning is done for dotting, and the two do not interfere with each other.
Ground-type braiding system supports automatic adjustment of the adjustable range of track width for adapting to the carrier belt, 8-32 mm, and 6-in-8-out track for piping can be used in the same body width.
Extensibility is strong, the braiding/pallet can be mounted and used as long as the equipment mesa structure is supported.
It meets the requirement of burning/testing 1-64 IC at one time, and the 360 degree rotation function of 4 suction nozzles does not need to consider the direction of incoming point.
Solve customer burning time is long, labor-intensive, omnipotent burning/testing robot.
This product is mainly used for testing/packaging conversion/identification of IC (integrated circuit)
Testable items:
IC TYPE:MCU,FLASH,EMMC,NAND FLASH,EPROM,Wait...
IC ENCAPSULATION:SOP,SSOP,TSSOP,MSOP,QFP,QFN,BGA,TQFP,LQFP,Wait...
IC Packing:Tray、Tube、Tape
technical specifications
Product model | ZH2000 | Machine architecture | Cantilever type |
Fastest speed | 1200±100UPH | Accuracy of fetching and placing repetition | +/-0.01mm |
Travel range | X900mmY600mmZ70mm | Machine size | 1450×1150×1400mm |
weight | 130KG | Soket Fetch and release mode | Cylinder dropdown |
Suction nozzle | Double/four suction nozzles rotatable | Control system | PLC |
Workstation | 0-64Workstation optional | Power/Gas Source | 220V,50Hz/0.5MPa |
Suitable for IC packaging | SOP/QFN/BGA/QFP/All encapsulated IC | Suitable for programming | AP8000、204、7500、6104 |
Functional characteristics
★TP200落地式编带烧录系统 ★TR200托盘自动上下料烧录系统 ★6进8出管装烧录系统
1、支持自动调整适应载带的轨道宽度, 1、托盘包装可实现自动上料、收料、 1.支持一次性放入6根管子进
可调范围8-32mm实现进出料一体化的烧录需求。 不需要人为干预,支持边烧录边打点 8根管子出1跟NG管,
节省人力成本。提高烧录效率。 两者互不干涉,一次性可上料20盘。 2.烧录效率快速顺畅
2、采用独立式可分离的机型,方便搬运摆放 2、采用独立式可分离的机型,方便搬运摆放、
只要台面结构支持均可搭载其他机型上使用。 只要台面结构支持均可搭载其他机型上使用。
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